I’ll be ordering my next batch of Mimeo’s sometime in October and be able to start shipping PCBs sometime in November. Keep an eye on this blog for an announcement in November. This version will fix a couple of minor issues in the silk screen layer, but the copper and mask layers will be identical with the last version.

I’m completely going over the Apple II rev 0 reproduction PCB layout. This was the first reproduction PCB that I did and either my skills or my standards have gone up. I’m tweaking a lot of minor issues, mostly on the front of the board, particularly on the silk screen layer. The average person will not notice any difference, but some Mimeo builders have turned out to not be average people. The first time around, I didn’t have a really good bare board image of the front side, only the poor photocopy of a bare board that can be seen in the “Red Book”. Since that time, a couple of bare board, rev 0 PCBs have turned up, and I have a really good scan of the front of one of them. Anyway, I’m mostly done with the tweaking, and only need to fix a few minor things and do a good bit of design checking. I hope to have boards made and ready to ship by the end of the year. With all the tweaking I’m doing, I’ll have to build one, before shipping, just to make sure I didn’t mess something up.